| abstract |
The present invention relates to a polyamide molding composition comprising the following components (A) to (C) or consisting of these components: (A) 50 to 98% by weight of at least one specific amorphous copolyamide formed from the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semicrystalline polyamide selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018, and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; wherein the proportions of components (A) to (C) add up to 100 wt .-% in total. Furthermore, the invention relates to moldings of this polyamide molding composition and their use. |