| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fb9f44db08d1c42a53f3d28eaae416f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-7166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-6886 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y70-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
| filingDate |
2017-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bbf28d6d9081d13dab98149e9faceba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14ffd14b07dfe4139f04e831cc51a4b1 |
| publicationDate |
2019-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3492511-A1 |
| titleOfInvention |
Fusible material for three-dimensional molding |
| abstract |
The soluble material for three-dimensional modeling according to the present invention is a soluble material for three-dimensional modeling that is used as a material of a support material that supports a three-dimensional object when manufacturing the three-dimensional object with a 3D printer of an FDM system, in which the soluble material for three-dimensional modeling contains a polyamide resin, the polyamide resin has a hydrophilic monomer unit A having a hydrophilic group, a hydrophobic dicarboxylic acid monomer unit B, and a hydrophobic diamine monomer unit C, and a ratio of an amount of the hydrophilic monomer unit A to a total amount of monomer units in the polyamide resin is 2.5 mol% or more and less than 13.5 mol%. The present invention provides a soluble material for three-dimensional modeling which is used for a support material, and which is suitable for the production of a three-dimensional object by use of an FDM system and has moisture absorption resistance while the material is large in dissolution rate into any neutral water and removable speedily from a precursor of the three-dimensional object without using any aqueous strong alkaline solution. |
| priorityDate |
2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |