http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3420586-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate | 2017-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_113e8dc7ef271224ed2aeb2fb621371e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95775dd763b2e874a2730f98e64dd4b9 |
| publicationDate | 2019-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-3420586-A1 |
| titleOfInvention | Adhesive for connecting a power electronic assembly to a heat sink, and composite made thereof |
| abstract | The invention relates to an adhesive for connecting a ceramic substrate, in particular a power-electronic assembly, in a heat-conductive manner, to a heat sink, and to a composite made of a heat sink and a ceramic substrate comprising the adhesive. By using hybrid metal-organic compounds and/or water glasses as the adhesive, high degrees of crosslinking are achieved and/or by means of the formation of covalent bonds between the adhesive and the joint partners and/or the filler particles, a clear increase of heat conductivity is achieved such that the heat-conductive adhesive layer exhibits a heat resistance which is substantially reduced compared to the prior art, and thus the heat dissipation chain is loaded less heavily than when using conventional joining and/or connecting methods. |
| priorityDate | 2016-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.