| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_18d938aa1b75b88f5a116a30536dc97b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2018-00434
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-24 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0534
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0539
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05 |
| filingDate |
2017-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d889f027292bc35be37c9e85337519de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3038f6423b92900f3df0da9b30cacc81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92b8dc960da1b79e60449d1b4fd4e9c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0402f7a4d76b356cc8a9cc6013c61e7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e2f35b9fb0c9324a5d19c665d492deb |
| publicationDate |
2019-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3419713-A1 |
| titleOfInvention |
Method of manufacturing an implantable neural electrode interface platform |
| abstract |
The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires. |
| priorityDate |
2016-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |