| abstract |
The present disclosure generally relates to adhesive compositions, adhesive articles including the adhesive compositions, methods of making the adhesive compositions and articles, and methods of using the adhesive compositions and articles. The adhesive compositions of the present disclosure include a thermoplastic phenolic resin made from the reaction of (1) alkyl phenol (e.g., butyl- or octyl- or -nonyl) and formaldehyde; or (2) alkyl phenol (e.g., butyl- or octyl-) and acetaldehyde; or (3) alkyl phenol (e.g., butyl- or octyl-) and acetylene. The present disclosure also generally relates to adhesive articles including these adhesive compositions. The inventors of the present disclosure found that such adhesive articles exhibit excellent adhesion to architectural coatings with including low or no VOCs, deep base formulations, and/or formulations including primer in various conditions, including, for example, high humidity. |