| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f34119b232d292c72e632b62008eca90 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-37512
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N2001-37294
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3754
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-0245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0017 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-372 |
| filingDate |
2016-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15d9131bb0dda690e9f6849b6e1e710f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42c0eb59303d91602a8a6e21962b6426 |
| publicationDate |
2018-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3393577-A1 |
| titleOfInvention |
Sealed package and method of forming same |
| abstract |
Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact. |
| priorityDate |
2015-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |