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filingDate 2016-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a756495d6e42d22df1b5bb83dbc6cf1
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publicationDate 2018-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-3356488-A1
titleOfInvention Non-reactive hot-melt adhesive with specific resin
abstract The invention pertains to a non-reactive hot-melt adhesive comprising - 10-90 wt.%, calculated on the weight of the adhesive, of amorphous thermoplastic resin which is compatible with polylactic acid, wherein the amorphous thermoplastic resin is a random copolymer of lactic acid and further reactive monomer, - 10-90 wt.%, calculated on the weight of the adhesive, of a polylactic acid polymer unit (PLAU) selected from poly-L-lactic acid (PLLAU) and poly-D-lactic acid (PDLAU), the unit having a number average molecular weight of at least 0.7 kg/mol. In one embodiment the non-reactive hot-melt adhesive further comprises 0.5-20 wt.%, preferably 1-10 wt.%, calculated on the weight of the first PLAU, of a second polylactic acid polymer unit (PLAU) selected from poly-L-lactic acid (PLLAU) and poly-D-lactic acid (PDLAU), the unit having a number average molecular weight of at least 0.75 kg/mol, wherein when the first PLAU is PLLAU, the second PLAU is PDLAU and when the first PLAU is PDLAU, the second PLAU is PLLAU. The non-reactive hot-melt according to the invention has desirable properties. It combines, int.al., a good adhesive performance with a good storage stability resulting from a low cold-flow, and may have a short set time.
priorityDate 2015-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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