| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 |
| filingDate |
2016-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2746af6605dc13deeec60d445fcab903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c75f941f39dd50394a956d8653d5558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d27edad7afc5084aeb31965b863edf1c |
| publicationDate |
2020-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3335239-B1 |
| titleOfInvention |
Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer |
| priorityDate |
2015-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |