http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3335239-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76259 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 |
| filingDate | 2016-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c75f941f39dd50394a956d8653d5558 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2746af6605dc13deeec60d445fcab903 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d27edad7afc5084aeb31965b863edf1c |
| publicationDate | 2018-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-3335239-A1 |
| titleOfInvention | Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer |
| abstract | The invention relates to a method for manufacturing a semiconductor structure, comprising the steps of: direct bonding of a substrate to be handled (1) with a grip substrate (2) via a bonding layer (3) covering the grip substrate, in order to form a temporary structure capable of withstanding technological steps; and removal of the temporary structure at the bonding layer in order to separate the substrate to be handled (1) from the grip substrate (2), characterised in that it comprises a prior step of depositing the bonding layer (3) onto the grip substrate (2) and/or onto the substrate to be handled (1), the bonding layer (3) being made of a porous material made up of an inorganic matrix and organic compounds optionally connected to said matrix, and in that the removal step is carried out by adding a thermal budget for removal to the intermediate structure (6, 16), said addition resulting in a spontaneous removal of the temporary structure occurring at the bonding layer. |
| priorityDate | 2015-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.