| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_535c73380d2f32cb7795ee0debeb0229 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1837
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate |
2016-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c09d02d7cea9456347ca41381c67b940
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c78f565a8a3c4a60d331f920abe6b2cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c79b58e7fa1b35c63daba3400be0dc70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efacf70ebd755980a0ff9567974768a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a401c59a3f6109af461b4fad368bd9c5 |
| publicationDate |
2018-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3334853-A1 |
| titleOfInvention |
Electroless silver plating bath and method of using the same |
| abstract |
An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath, The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs). |
| priorityDate |
2015-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |