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filingDate 2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cdf3a93768184464758461e53714709
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publicationDate 2018-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-3327176-A1
titleOfInvention Composition for etching treatment of resin material
abstract The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (2): n(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and nwherein the aqueous solution optionally further satisfies at least one of the following conditions (1) and (3): n(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, and n(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.
priorityDate 2013-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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