| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c85d78c6a4459b5dbbc49c82a4c5c107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D241-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D413-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D265-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G12-06 |
| filingDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6ef9d8ceb04fdf0c75b043d7269631d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3567d7767003f7cc4e8b7525a6541196
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b27cba807873e4d9e2436fa3363b9408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45987a7db67e935585413d4320f343e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d18d7eb8334b789ce24fc24c3c2c876b |
| publicationDate |
2018-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3288990-A1 |
| titleOfInvention |
Reaction products of bisanhydrids and diamines as additives for electroplating baths |
| abstract |
Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias. |
| priorityDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |