| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-54 |
| filingDate |
2017-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c67ff41a28e16f4b1600c8f6b89c0d5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55cf417591e421ba7ff95ac652e655ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_017f4fb405e1337f088fcb4f01cd98f4 |
| publicationDate |
2018-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3272911-A1 |
| titleOfInvention |
Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium |
| abstract |
Indium electroplating compositions containing 2-imidazolidinethione compounds electroplate substantially defect-free uniform layers which have a smooth surface morphology on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials. |
| priorityDate |
2016-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |