| abstract |
A die and substrate assembly (10) is disclosed for a die (12) with electronic circuitry and a substrate (14). A sintered bonding layer (16, 16A) of sintered metal (e.g. silver) is disposed between the die (12) and the substrate (14). The sintered bonding layer (16, 16A) includes a plurality of zones (18, 18', 18", 20, 20', 20") having different sintered metal densities. The plurality of zones (18, 18', 18", 20, 20', 20") are distributed along one or more horizontal axes of the sintered bonding layer (16), along one or more vertical axes of the sintered bonding layer (16) or along both one or more horizontal and one or more vertical axes of the sintered bonding layer (16A). |