| abstract |
The present invention provides a1 k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate, the adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UV/Vis/LED or thermal or combined and is cured faster requiring lower energy. The present invention also provides assemblies including such an adhesive and methods of using the adhesives. |