| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7d32b555610ab7bd837a596cffa01f02 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2015-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbdb8c24f2283a2f42d0d9972133b37a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_027c982ab5dea74d0f0d972ab9a29cef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3fb55d6b49b9692e86e05dd15fb3b36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3692de7465712c8de80f026dfc17c2e0 |
| publicationDate |
2017-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3234957-A1 |
| titleOfInvention |
Low-warpage ceramic carrier plate and method for production |
| abstract |
The invention relates to a carrier plate, wherein a first ceramic functional layer is braced by a ceramic stressing layer (SPS) via a connecting layer (VS) in order to reduce the lateral sintering shrinkage. The functional layer (FS) and the stressing layer (SPS) are glass-free or have an only slight glass content of less than 5 wt%, while the connecting layer (VS) comprises a glass component or is a glass layer. |
| priorityDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |