| abstract |
An electrical or opto-electrical subassembly is described, comprising: a submount defining at least a first contact; a chip mounted on said submount defining at least a second contact, wherein said first and second contacts define a distance therebetween; wherein at least one of said first or second contacts defines a coated portion comprising a layer of material having low wettability for solder, and a non-coated portion; and solder electrically connecting said first and second contacts, said solder being balled-up on said non-coated portion to span said distance between said first and second contacts. |