| abstract |
A sensor chip package assembly and an electronic device having the sensor chip package assembly are disclosed, where the sensor chip package assembly includes: a metal substrate (100) which has a bonding pad region (11) and a placement region (12), the bonding pad region having a plurality of metal bonding pads (13); a sensor chip (200) which is located on an upper surface of the metal substrate, and the sensor chip having a plurality of sensor chip bonding pads (21); an electrical connection assembly (300) which electrically connects a metal bonding pad and a sensor chip bonding pad; and a packaging material cover (400) which covers the metal substrate, the sensor chip and the electrical connection assembly, where any two adjacent metal bonding pads are spaced in an insulated manner by the packaging material cover. The sensor chip package assembly has advantages of a short development period and small warpage, thus improving efficiency of subsequent assembly while saving cost. In addition, since a plurality of metal bonding pads are independent from each other on a metal substrate, independent transmission of a plurality of signals between a sensor chip and the metal substrate may be realized, thus dramatically reducing risk of interference among the plurality of signals. |