Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c10e1e222f10a69411e659d01c18b83 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
filingDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc37037a3f2826d911d1ee4ee37cc857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf4a36e52a3e61f877f197dc68e5e1ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30fc99b29e09a3f983af76879fc77333 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1158a7457db580025b015c4008c67e4c |
publicationDate |
2017-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-3208364-A1 |
titleOfInvention |
Copper-nickel alloy electroplating device |
abstract |
Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6) ; an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode. |
priorityDate |
2014-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |