| abstract |
In order to manufacture an alloy bump, a resist pattern 12 having openings 13 which expose a substrate 10 is formed on the substrate 10, an under-bump metal 11 is formed on the substrate 10 inside the openings 13, a first plating film 14 is formed on the under-bump metal 11 by electroplating, a second plating film 15 containing no metal components which are contained in the first plating film 14 is formed on the first plating film 14 by electroplating, the resist pattern 12 is removed, and the alloy bump 16 is formed by heat treating the substrate 11 to thereby alloy the first plating film 14 and the second plating film 15. |