| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98f92c496e4f5c70f34681fb4bf526d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4813 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-2406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-02 |
| filingDate |
2015-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fca759faaaf0e67dc3443e9087bed922
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048db0aa319da11ac3d3c76671a9b01d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded577b80a06de2133f3ca81364afef1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9016b59d3a299e608b7c390fa3eaa783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05e9a4a3314a9dbf92800121f70680a |
| publicationDate |
2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3169450-A1 |
| titleOfInvention |
Microfabricated ultrasonic transducers and related apparatus and methods |
| abstract |
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities (306) in a substrate (302). Wafer bonding may also be used to bond the substrate (302) to another substrate (304), such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature. |
| priorityDate |
2014-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |