| abstract |
The present invention relates to co-initiator systems for epoxy cure comprising a compound of formula {M n+ (X) a- n/a }, wherein M is a metal cation, X is a counter ion, a is an integer from 1 to 3 and n is an integer from 1 to 6, and a carboxylic acid. The present invention further relates to resin compositions that contain such co-initiator system and are curable at room temperature as well as methods for the preparation of the co-initiator systems and the resin compositions, methods for curing them and the cured products. |