abstract |
Provided is a silicon wafer polishing composition having an excellent effect of reducing the haze on the surface of silicon wafers. The composition for polishing silicon wafers provided here includes abrasive grains, a silicon-wafer polishing accelerator, an amido group-containing polymer, and water. The amido group-containing polymer has, on the main chain, a building block A derived from a monomer represented by General Formula (1). The abrasive grains have an average secondary particle size of 10 nm or more and 60 nm or less. |