| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_599f2f570b3a989fa9076f8465318ddc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26c475bcbe0c24b485b6f37c45cd921f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2015-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e40830e983e7198fdcfdd6e8b840d77e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c7dfb658b8665cef2f11d03d4809335
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d898c09e3a4d87c8ca10743a5aa1693e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62e2d4e1019343f8b35cd07b7628bc92 |
| publicationDate |
2017-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3111451-A1 |
| titleOfInvention |
Sinterable metal particles and the use thereof in electronics applications |
| abstract |
Provided herein are sinterable metal particles and compositions containing same. Such compositions can be used in a variety of ways, i.e., by replacing solders as die attach materials. The resulting sintered compositions are useful as a replacement for solder in conventional semiconductor assembly, and provide enhanced thermal and electrical conductivity in high power devices. Thus, invention compositions provide an alternative to nano-particulate metals that must be subjected to mechanical force during cure. |
| priorityDate |
2014-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |