| abstract |
Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating surface of a conductive laminate or the like, so that a surface of the conductive laminate or the like can be protected as well as that a peeling force can be maintained appropriately regardless of a peeling rate even after a heat treatment for sintering, and thus can be used for a protective film. |