| abstract |
Provided is an adhesive composition which has cutting processability when it is fitted to the shape of an adherend part before pasting and processed, long-term storage stability at a normal temperature before pasting of the cut shape after processing, low temperature melting properties of not imparting damage to the adherend part when being pasted, and uneven step absorbability after pasting. Hence, an adhesive composition which contains a crosslinking agent and a photopolymerization initiator at from 1 to 50 parts by weight and from 0.3 to 3 parts by weight based on 100 parts by weight of an ethylene-±-olefin-based copolymer, respectively, and has a crystal melting peak by DSC of from 30 to 80°C is proposed. |