| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1633
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2014-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30b288cdb86221ab917ca7c133412a8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37ff8d3b276c4748af3c7b64d90f30ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79f6bf8381b5570a7b030a0ea5127236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ff572d5f5fc1c304b56c968736bf8a2 |
| publicationDate |
2018-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3049550-B1 |
| titleOfInvention |
Method for depositing a copper seed layer onto a barrier layer and copper plating bath |
| priorityDate |
2013-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |