| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B9-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-10 |
| filingDate |
2014-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217fd2dbe27cf853d70732db5a5696d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba88f45ed8b516b71dd73178bd131895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12f28a0a802afffd118963e211a446d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c8aaab998f83b30d6c6ba25cfdd6f70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87e92ce962775c03bf6a870d70840c5c |
| publicationDate |
2016-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3049549-A1 |
| titleOfInvention |
Method for treatment of recessed structures in dielectric materials for smear removal |
| abstract |
The present invention relates to a method for treatment of recessed structures in a dielectric material for smear removal during the manufacture of printed circuit boards, IC substrates and the like. The dielectric material is contacted with an aqueous solution comprising 60 to 80 wt.-% sulfuric acid and 0.04 to 0.66 mol/l peroxodisulfate ions peroxodisulfate ions and at least one stabilizing additive selected from alcohols, molecular ethers and polymeric ethers. Smear is removed from the recessed structures by the method according to the present invention without penetration of process chemicals into the dielectric material and a sufficiently low copper etching rate is achieved. Furthermore, the shelf life of said aqueous solution is improved even in the presence of copper ions. |
| priorityDate |
2013-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |