| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate |
2015-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ede29555cb4b4e961bd3abb345187cb3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1db4906f03cb7a84e0bc78873b9755d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0aec2b9c0f6ec5eb80baff255ed1f03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4273282efd3b3f20dc0530b53f48501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccf9ccaf3031042ae7fc37a6ae2cc731 |
| publicationDate |
2019-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3037572-B1 |
| titleOfInvention |
Electrolytic copper plating solution |
| priorityDate |
2014-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |