| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J161-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
2015-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87bb3e78a75a173586cc1295d23199d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_289e8748cb5c9417b1cc93c3818a4f46 |
| publicationDate |
2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3037492-A1 |
| titleOfInvention |
Liquid underfill material composition for sealing semiconductor and flip-chip semiconductor device |
| abstract |
Provided is a liquid underfill material composition which has a favorable curing property without adding a curing catalyst; a favorable thin film penetration ability derived from its low viscosity; a favorable adhesiveness; and a high heat resistance property. The liquid underfill material composition for sealing a semiconductor contains specific amounts of: n(A) a cyanate ester resin having at least two cyanate groups in one molecule; n(B) a phenolic curing agent including a resorcinol type phenol resin; and n(C) an inorganic filler including (C-1) an inorganic filler (A) which is a silica having an average particle size of 0.1 to 3 µm; and (C-2) an inorganic filler (B) which comprises an amorphous nanosilica having an average particle size of 5 to 70 nm. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10407536-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3115393-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3101046-A1 |
| priorityDate |
2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |