| abstract |
The present invention relates to a precursor composition comprising ni) at least one metal-organic silver compound, nii) at least one metal-organic palladium compound, niii) at least one metal-organic copper compound, and niv) at least one solvent, nwherein the composition comprises components i), ii) and iii) in such a relative amount that the composition comprises n- at least 90 wt.-% of silver, n- 0.01 to 5 wt.-% of palladium, and n- 0.01 to 5 wt.-% of copper, nin each case based on the total amount of metals in the precursor composition. n The present invention also relates to a process for the production of a layered body, to a layered body obtainable by the process of the present invention, to a layered body comprising a substrate and a metal layer superimposed onto at last a part of at least one surface of the substrate and to a electronic component. |