| abstract |
This disclosure relates to a polyurethane mounting pad having Low P compressibility of 1 to 10%, the Low P compressibility being the ratio of the difference between a first thickness and a second thickness to the first thickness, the first thickness being measured by applying a pressure of 5g/cm 2 to a thickness direction of the mounting pad, and the second thickness being measured by applying a pressure of 100g/cm 2 to a thickness direction of the mounting pad, wherein Low P compression length, which is the difference between the first thickness and the second thickness, is 15 to 100 ยต m. According to the present invention, provided is a polyurethane mounting pad that has high compressibility and excellent elastic power under practical polishing conditions, and can realize more uniform and high efficiency polishing to decrease defective polishing rate. |