http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2984131-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D01F1-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D01F6-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D01F1-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D01F6-60 |
| filingDate | 2014-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbb47d85c958e2f2af7aa85be5bfb3a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31f8668f0d1713590123201590275547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a80d48e4902493e9d34944bad86090d |
| publicationDate | 2016-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2984131-A1 |
| titleOfInvention | Stabilization of polyamide with copper-based metal organic frameworks |
| abstract | The invention relates to a method for manufacturing of a stabilized polyamide- containing composition, which contains at least 20% by weight of polyamide, which comprises the steps of - incorporating of a metal organic framework, which is a copper-based metal organic framework comprising metal ions, which are copper(ll)-ions, and a C6-C24 aromatic hydrocarbon, which is substituted with at least two carboxylate groups, wherein two of the at least two carboxylate groups are forming coordinative bonds to the metal ions, into a polyamide-containing composition, which contains at least 20% by weight of polyamide, to obtain a mixture for molding, which contains at least 20% by weight of polyamide; and - heating of the obtained mixture for molding comprising the polyamide-containing composition and the metal organic framework to a temperature between 170 °C and 380 °C. |
| priorityDate | 2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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