| abstract |
A method of joining components, comprising providing an array of at least two devices having a common contact surface formed from metallic contact surfaces of the two devices and pressure sintering the device, the metallic contact surface of at least one of the two devices being covered with a metal oxide layer, and I) the pressure sintering is carried out in an atmosphere containing at least one oxidizable compound and / or (II) the metal oxide layer is provided with at least one oxidizable organic compound prior to formation of the common contact surface. |