http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2934024-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a7b097bfd3f350ed27ffa53e1f114d1a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00 |
| filingDate | 2013-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28bef128b75ebe6b97084d5b0fef4e87 |
| publicationDate | 2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2934024-A1 |
| titleOfInvention | Connection structure for semiconductor device, ultrasonic module, and ultrasonic endoscope system having built-in ultrasonic module |
| abstract | Provided is a semiconductor device connection structure capable of improving adhesion strength without influencing performance of a semiconductor element by a simple method. The semiconductor device connection structure according to the invention includes a silicon substrate having a plate shape and including an external connection electrode on a surface thereof; a support member which is adhered to a rear surface of the silicon substrate and of which adhesion surface has a column shape that is substantially same as that of the silicon substrate, a thickness of the support member being larger than that of the silicon substrate; and a flexible board having an inner lead therein configured to be connected to the external connection electrode. The flexible board is arranged on a side surface of the silicon substrate and is adhered to the support member with an adhesive. |
| priorityDate | 2012-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
Total number of triples: 22.