| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fae4ca17beecc8aeabdb923a48968941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_767e76490031249117bd44703f6d5a33 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76892
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K15-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
2013-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91744505db9c76cbd5d0b925495176c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3599b4cacffd2fd69bd62d13e091e6ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0640cde1fa71caeda2f311166a20dcea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc922691b8bc58c32c40ed7e2ef0be56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63f3f5c65de93a01e3d3e4b0f369f37b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b3c4d5400d28e1c7973defa823fb47a |
| publicationDate |
2015-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2904882-A1 |
| titleOfInvention |
Electrical components and methods and systems of manufacturing electrical components |
| abstract |
A method of manufacturing an electrical component (100) includes providing a substrate (104), applying an insulating layer (110) on the substrate, applying a circuit layer (112) on the insulating layer, irradiating the insulating layer with an electron beam (114) to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module (102) or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer. |
| priorityDate |
2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |