| abstract |
Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R 11 and R 14 independently represents a hydrogen atom or a hydroxy group; and each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group. |