| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2013-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d23bbea45aa676bf05607b9d5afbf256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82b46b4be8ca4480c3419df377d0beb1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feb3f68f6e46618d1aaa667781d3d81e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9f8390be15a377ff8c23201fcd2cbb1 |
| publicationDate |
2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2810971-A1 |
| titleOfInvention |
Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same |
| abstract |
The present invention provides a resin composition which is capable of forming a roughened surface with low roughness on a surface of an insulating layer regardless of roughening conditions when used as a material of an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also which has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. Disclosed is a resin composition including an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3357687-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11046046-B2 |
| priorityDate |
2012-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |