Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33b011e77b33662b8bf1f2ff2de7b661 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-168 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-005 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 |
filingDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aedf739163466bde47526096dd5dac3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec745ca65cd6beb0ea9f71099c7d6ab5 |
publicationDate |
2014-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2795627-A1 |
titleOfInvention |
Ink composition for making a conductive silver structure |
abstract |
An ink composition for making a conductive silver structure comprises a silver salt and a complex of (a) a complexing agent and a short chain carboxylic acid or (b) a complexing agent and a salt of a short chain carboxylic acid, according to one embodiment. A method for making a silver structure entails combining a silver salt and a complexing agent, and then adding a short chain carboxylic acid or a salt of the short chain carboxylic acid to the combined silver salt and a complexing agent to form an ink composition. A concentration of the complexing agent in the ink composition is reduced to form a concentrated formulation, and the silver salt is reduced to form a conductive silver structure, where the concentrated formulation and the conductive silver structure are formed at a temperature of about 120°C or less. |
priorityDate |
2011-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |