Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02T50-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1865 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
filingDate |
2012-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_475ae0272d54e0e98e3747d7816695d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dba9b77e0038e05887750f4e4b965313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217fd2dbe27cf853d70732db5a5696d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37ff8d3b276c4748af3c7b64d90f30ed |
publicationDate |
2014-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2788529-A2 |
titleOfInvention |
Novel adhesion promoting agents for metallization of substrate surfaces |
abstract |
A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate. |
priorityDate |
2011-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |