| abstract |
The present invention provides a photocurable moistureproof insulating coating material for mounting circuit boards, comprising a curable composition comprising: n(component A) a compound having a structural unit derived from a dimerdiol and having, as an end group, a group represented by formula (1):n nwherein R 1 represents H or CH 3 and R 2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end of the compound; n(component B) a non-silicon-containing monofunctional (meth)acryloyl group-containing compound; and n(component C) a photopolymerization initiator. |