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filingDate 2012-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ce0df7dc934a57d23f24b1361245d99
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publicationDate 2014-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2727133-A1
titleOfInvention Method for manufacturing a thick epitaxial layer of gallium nitride on a silicon or similar substrate and layer obtained using said method
abstract The invention relates to a method for manufacturing, by means of epitaxy, a monocrystalline layer (3; 3', 3") of GaN on a substrate (1) wherein the coefficient of thermal expansion is less than the coefficient of thermal expansion of GaN, comprising the following steps: (b) three-dimensional epitaxial growth of a layer (3a) of GaN relaxed at the epitaxial temperature, (c1) growth of an intermediate layer (4a) of B w Al x Ga y ln z N, (c2) growth of a layer (3b) of B w Al x Ga y ln z N, (c3) growth of an intermediate layer (4b) of B w Al x Ga y ln z N, at least one of the layers (3b, 4a, 4b) formed in steps (c1) to (c3) being an at least ternary III-N alloy comprising aluminium and gallium, (d) growth of said layer (3; 3', 3") of GaN.
priorityDate 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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