http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2722872-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
| filingDate | 2012-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_504141c248f62d92ab25a0465303e736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31ffd014f8946a3276335c87c5bde587 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_930b51b37360bee3adef2aa255995c68 |
| publicationDate | 2014-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2722872-A1 |
| titleOfInvention | Polishing composition |
| abstract | A polishing composition of the present invention contains a water-soluble polymer having a hydrophilic group, and abrasive grains. A hydrophobic silicon-containing part after being polished with the polishing composition has a water contact angle lower than that of the hydrophobic silicon-containing part after being polished with another composition having the same makeup as the polishing composition except that the water-soluble polymer is not contained therein, and has a water contact angle of preferably 57° or less. Examples of the water-soluble polymer include polysaccharides and alcohol compounds. Another polishing composition of the present invention contains abrasive grains having a silanol group, and a water-soluble polymer. When this polishing composition is left to stand for one day in an environment at a temperature of 25°C, the water-soluble polymer is adsorbed on the abrasive grains at 5,000 or more molecules per 1 µm 2 of surface area of the abrasive grains. Examples of this water-soluble polymer include nonionic compounds, such as polyethylene glycol, having a polyoxyalkylene chain. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4112699-A1 |
| priorityDate | 2011-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.