Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-3045 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02 |
filingDate |
2012-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7915bcb8921d8b4df60c9f58f85f759c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b056dd29b3d47305039012674a17c80c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db3d4b991e9256c1bb3a194beb843686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc8b6ea3e4c83f4f1ed5da841ba8ce15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6308b96086777ba43c9d96a7c6e63f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a307d0fdecad754d3692029fdc3cd86d |
publicationDate |
2019-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2714807-B1 |
titleOfInvention |
Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3359552-A4 |
priorityDate |
2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |