| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b39fb91c4677b78564d686f9838b885 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 |
| filingDate |
2013-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69246f1a7711a1447cd1f48a63a96a0c |
| publicationDate |
2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2713683-A1 |
| titleOfInvention |
Method for manufacturing circuit board, circuit board and electronic apparatus |
| abstract |
Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the chamber division part uses a shielding frame, and other parts including an edge part and a surface part of the whole machine use a conducting material for shielding, thereby having little effect on a size of the whole machine; moreover, the cutting height is decreased because the plastic package material changes from originally needing to be directly cut to a surface of a PCB to directly being cut to the surface of the shielding frame, the processing time is short, and good manufacturability is provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160117539-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9913412-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015142427-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015142426-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9820373-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11266010-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9949359-B2 |
| priorityDate |
2012-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |