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filingDate 2012-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0f7cd03a420db6021ed60f951435aa6
publicationDate 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2710171-A2
titleOfInvention Wetting agent for electrolytic applications and use thereof
abstract The invention relates to a wetting agent and to its use. The wetting agent of the invention for electroplating applications comprises a biodegradable surfactant which is present in a solution in water, in a concentration from 1:1 to 1:10, and allows foam to be formed during the electroplating application, the stability of the foam formed allowing retarded release of the hydrogen that is formed during the galvanic application. This wetting agent is stable to degradation and has no effect at all on the electroplating application, so that the workpieces processed with the galvanic application are unaffected by the use of the wetting agent of the invention. Moreover, the wetting agent of the invention exhibits good biodegradability, removing any need for separate disposal of the wetting agent after the application. Moreover, the level of consumption of the wetting agent is comparable with that when using PFOS-containing wetting agents. All in all, the wetting agent of the invention provides a simple, eco-friendly and at the same time cost-effective alternative to the known PFOS-free wetting agents, with the wetting agent of the invention exerting no effect on the outcome of the electroplating application, by virtue of reduced wetting agent consumption and by virtue of the chemically inert properties of said wetting agent.
priorityDate 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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