Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31696 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-05 |
filingDate |
2009-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dabe912fe6c6e0a19b7f061b126ae217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91054be4df1c1c46ecbd9dda9f98491b |
publicationDate |
2017-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2706585-A3 |
titleOfInvention |
Component based on organic electronics |
abstract |
The invention relates to a novel anchor group for organic dielectric compounds, as used in particular in the production of organically based capacitors. For the first time, capacitors are described here that can be produced on copper in a parallel process on a prepreg or other common printed circuit substrates without additional metallization. Following this, the prefabricated capacitor layer can be integrated into the printed circuit board, which results in a space / cost gain for the surface of the printed circuit board. |
priorityDate |
2008-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |