| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8ed020d9d1eed3acfa2285b2f55de30 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-26506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-2003 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265 |
| filingDate |
2012-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c71f5648677e69aca7ef8e921fe564e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f33cdcb48bfb1fb894a8087431c8a165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ea6bb87cc83c12299f79e524721388c |
| publicationDate |
2018-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2695184-B1 |
| titleOfInvention |
Processing a wafer for an electronic circuit |
| priorityDate |
2011-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |