| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d4ada69388e0a1b68daaf536597c732 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-024 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2012-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5353d4e88063bc8cbbe1f242822ff07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc87fa80556cce900b9017557fac8117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f3cadb65e3ac046b3e28aa849725251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6bfa5e055affa512b33c1846e936e31 |
| publicationDate |
2014-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2689643-A1 |
| titleOfInvention |
Thermal management within an led assembly |
| abstract |
This invention is directed to a method for applying a thermal management composition between an LED mounted circuit board and a heat sink, comprising the steps of; (a) applying a deposit of a thermal management composition onto either a second surface of the LED mounted circuit board or onto a surface of a heat sink, through a deposition tool the deposition tool having at least one aperture (401) where the at least one aperture has a perimeter surrounded by sidewalls, where the sidewalls have heights, where the heights are reduced around at least a portion (402) of the perimeter of the apertures on the deposition tool as compared to the average height of the deposition tool and (b) securing the LED mounted circuit board and the heat sink. |
| priorityDate |
2011-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |