| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9bd12c65f4cf11fe1fc9a4050c16e359 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0079 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-34 |
| filingDate |
2013-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85adc5eef21a90d065bb544cbadd31a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6443c607e0b8ca5827a97d591510898b |
| publicationDate |
2013-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2662424-A1 |
| titleOfInvention |
Hot melt composition and a method and system for manufacturing electronic and/or optical components using such hot melt composition |
| abstract |
The present invention relates to the use of a hot melt composition comprising an alkane based wax and an amorphous material as a masking material in a process for manufacturing electrical and/or optical components. The hot melt composition has a melting point of between 40°C and 85°C and a viscosity of between 5 and 20 mPa·s at not less than one temperature within the range of between 50°C and 140°C. n The present invention also relates to a hot melt composition comprising between 40 weight% and 89.9 weight% of an alkane based wax; between 10 weight% and 50 weight% of an amorphous material; and between 0.1 weight% and 10 weight% of a phosphonium based ionic liquid. n The present invention also relates to a system and a method for manufacturing electronic and/or optical components, wherein after the etch processes and/or plating processes, the hot melt composition is removed from the substrate with the aid of hot water. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3230423-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104409572-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9631108-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9631107-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016044228-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105694592-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106795387-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105694592-A |
| priorityDate |
2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |